EE Agenda, ECAL week, June, 2000
1) Test beam and crystals
Test beam H2 update
H Heath EE
Crystal update
D Cockerill
Results from the IC Crystal
Lab
D Britton
2) EE cooling and test setups
Overview
of EE cooling
J Greenhalgh
Thermal
tests
J Greenhalgh
Y2000
supercrystal test bench
J Greenhalgh/T Lodge
Thermal control of the VFE Readout T Lodge
3) EDR Preparation
Notes on the items listed below
Review of previous Russian design work - A Surkov
Dee and Dee lab, assembly/loading of
Supercrystals onto Dee
Transport of Dee, to H4, to CMS
Rotation of Dee
Assembly of Dee onto HE in CMS, in pit
New calibration table design
Use of OPAL Endcap Dee frames etc, visit to see
OPAL equipment
Discussion what needs updating or changing for
the EDR.
4) EE/SE (Restricted)
Environmental shield and patch panels
L Denton
Outer crystal
boundaries
B Kennedy
Inner crystal
boundaries, crystals to eta = 3 D
Cockerill
Requirements of EE
towards eta 3
J Greenhalgh
alignment channels
?
support
cone for SE
P Wertelaers
support cone for EE
A Surkov
thermal interface
SE/EE
J Greenhalgh
thermal
interface SE/EE
P Wertelaers
5) VPTs and Supercrystal
VPT tender update, VPT sketch
RM
Brown
Supercrystal
Engineering tests
B Smith
Alveolar
inspection - cell sizes
B Smith/N Golubev
Alveolar
inspection - full report
B
Smith/N Golubev
SC High Voltage
cards
T Lodge
Component
irradiation studies
J Greenhalgh
6) Safety issues for the EDR R Schmidt